Apple disclosed a $30 billion agreement with Broadcom to source wireless chips manufactured in the United States. The partnership calls for Broadcom to design and supply custom silicon for a broad range of Apple devices, from iPhones to future wearables.
Of the total amount, $1.5 billion is allocated to expand Broadcom’s Fort Collins, Colorado fab, where the company will add capacity for advanced radio‑frequency components. The deal projects the production of roughly 15 billion US‑made chips, including the FBAR filter technology that Apple uses to isolate specific wireless bands. While Broadcom will handle design, much of the actual wafer fabrication will still rely on third‑party foundries such as TSMC.
The contract arrives after a year of pressure on Apple to deepen its domestic supply chain amid looming tariff threats. Apple previously pledged up to $600 billion in investments over the next four years, and the Broadcom deal marks the largest single commitment announced so far, suggesting additional sizable agreements may follow.
